Product Center
PRSE's advanced manufacturing fleet delivers unparalleled precision and speed, providing the technological foundation for your most complex and mission-critical PCBs.
Technologies > Product Center
IC Substrate
Bridging silicon and system with precision-engineered substrates for superior thermal and signal performance in AI and 5G systems.
Return to List
Product Information

Precision IC substrates engineered by PRS are to unleash the full potential of advanced semiconductors. Our solutions provide the essential foundation for high-performance computing, and 5G systems - enabling ultra-high-density interconnections, superior thermal management, and uncompromised signal integrity. Leveraging cutting-edge manufacturing and materials, we ensure your most innovative designs achieve optimal performance, reliability, and miniaturization.
Partner with PRS to build the future of technology from the substrate up.


Layer6



产品12.jpg

Final Thickness0.29mm
MaterialMGC HL832NS
Product TypeSIP
Strip Size240*74mm
Surface FinishSoft Au+Hard Au+OSP
Drill0.065mm
Copper Thickness15um
Minimum Hole Size18/18um
Business SegmentConsumer Electronics


Layer6


产品13.jpg

Final Thickness0.23mm
MaterialDS-7409HGBJE(M)
Product TypeLGA
Strip Size93.81*93.81mm
Surface FinishENIG
Drill0.055mm
Copper Thickness12um
Minimum Hole Size30/40um
Business SegmentConsumer Electronics