Product Information
Precision IC substrates engineered by PRS are to unleash the full potential of advanced semiconductors. Our solutions provide the essential foundation for high-performance computing, and 5G systems - enabling ultra-high-density interconnections, superior thermal management, and uncompromised signal integrity. Leveraging cutting-edge manufacturing and materials, we ensure your most innovative designs achieve optimal performance, reliability, and miniaturization.
Partner with PRS to build the future of technology from the substrate up.
Layer | 6 | |
Final Thickness | 0.29mm | |
Material | MGC HL832NS | |
Product Type | SIP | |
Strip Size | 240*74mm | |
Surface Finish | Soft Au+Hard Au+OSP | |
Drill | 0.065mm | |
Copper Thickness | 15um | |
Minimum Hole Size | 18/18um | |
Business Segment | Consumer Electronics |
Layer | 6 | |
Final Thickness | 0.23mm | |
Material | DS-7409HGBJE(M) | |
Product Type | LGA | |
Strip Size | 93.81*93.81mm | |
Surface Finish | ENIG | |
Drill | 0.055mm | |
Copper Thickness | 12um | |
Minimum Hole Size | 30/40um | |
Business Segment | Consumer Electronics |